Electrodeposition (electrochemical deposition or electroplating) is a material processing technology. It uses electric current to cause a material (typically a metal) to deposit on an electrode. The electrode is immersed in an electrolyte containing ions of the material. Applied current causes the material to form a deposit.
Electrodeposition is for a variety of applications, most commonly to create coatings that improve corrosion resistance, wear resistance, conductivity, or appearance.
The 20th century expanded uses to electronics, including flip-chip solder in the 1990s. Recent advances focus on nanostructures, alloys, and energy materials.
Variations
Electroforming
Electroforming uses electrodeposition to create metal parts, typically by depositing relatively thick layers on a mandrel that is removed after forming. The mandrel features conductive areas (that accept deposition) and non-conductive areas (that do not).
Emerging uses include:
Advantages and disadvantages
Advantages include low cost, room-temperature operation, conformal coverage on complex shapes, precise thickness control, and scalability. It enables alloy and composite deposits. One study reported that electrodeposition processing capacity (29 g g−1) was two orders of magnitude higher than that of adsorption, including selectively depositing specific metals using alternating current (AC).